This equipment is a wafer cleaning & spin-drying dedicated machine designed and manufactured by Wuxi Pioneer Automation Technology Co., Ltd. for Chengdu Jinlanxin Electronics Co., Ltd. It operates semi-automatically: after an operator places the wafer-loaded cassette on the loading platform and presses the start button, the equipment automatically performs ultrasonic cleaning, cassette blow-drying, wafer flipping and single-wafer pick, single-wafer cleaning and spin-drying; once a full cassette is processed, the operator removes the cassette from the discharge end. The machine is intended for the batch cleaning & spin-drying of one customer-specified wafer size.

The equipment footprint is 2,400 mm (W) × 2,600 mm (D) × 2,000 mm (H). The line adopts a compact modular layout: the left side is the loading / cassette-processing area, the middle is the dual-tank ultrasonic cleaning & blow-drying area, and the right side is the single-wafer pick, single-wafer cleaning and spin-drying area. The cassette-handling gantry robot and the single-wafer pick gantry robot are respectively responsible for cassette-level and wafer-level workpiece transfer.